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UBA2035
HF full bridge control IC for HID lighting
Rev. 01 -- 31 October 2008 Product data sheet
1. General description
The UBA2035 is a high voltage monolithic Integrated Circuit (IC) manufactured in a High Voltage Silicon On Insulator (HVSOI) process. This circuit is designed for driving MOSFETs in a full bridge configuration. In addition, it features a disable function, an internal adjustable oscillator and an external clock input function with a high-voltage level shifter for driving the bridge. To guarantee an accurate 50 % duty cycle, the oscillator signal can be passed through a divider before being fed to the output drivers. The UBA2035 is especially suitable for High Intensity Discharge (HID) lamp drivers for projectors and general lighting applications for which a small non-overlap time is required.
2. Features
I I I I I I I I I I Full bridge driver circuit Integrated bootstrap diodes 550 V series regulator input to make the internal supply 550 V maximum bridge voltage Accurate bridge disable function Input for start-up delay Adjustable oscillator frequency Selectable frequency divider Predefined bridge position during start-up A fixed non-overlap (< 200 ns)
3. Applications
I The UBA2035 can drive (via the power MOSFETs) any kind of load in a full bridge configuration I The circuit is especially designed as a commutator controller for high intensity discharge lamps in projectors and general lighting applications
4. Ordering information
Table 1. Ordering information Package Name UBA2035TS SSOP28 Description plastic shrink small outline package; 28 leads; body width 5.3 mm Version SOT341-1 Type number
NXP Semiconductors
UBA2035
HF Full bridge control IC for HID lighting
5. Block diagram
VSS(CLK) CLK VDD(CLK)
1
2
3 16 FSL HIGHER LEFT DRIVER 15 GHL 17
6 HV 14 SGND STABILIZER LOGIC SIGNAL GENERATOR OSCILLATOR HIGH VOLTAGE LEVEL SHIFTER HIGHER RIGHT DRIVER SHL FSR 27
VDD RC
9 13
28 26
GHR SHR GLR
UBA2035TS
/2 LOWER RIGHT DRIVER 23
21 SU BD 10 12 1.29 V bridge disable 11 DD 4, 5, 7, 8, 18, 19, 22, 24, 25 n.c.
014aaa629
PGND
LOGIC
LOW VOLTAGE LEVEL SHIFTER
LOWER LEFT DRIVER
20
GLL
Fig 1.
Block diagram
UBA2035_1
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Product data sheet
Rev. 01 -- 31 October 2008
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NXP Semiconductors
UBA2035
HF Full bridge control IC for HID lighting
6. Pinning information
6.1 Pinning
VSS(CLK) CLK VDD(CLK) n.c. n.c. HV n.c. n.c. VDD
1 2 3 4 5 6 7 8 9
28 GHR 27 FSR 26 SHR 25 n.c. 24 n.c. 23 GLR 22 n.c. 21 PGND 20 GLL 19 n.c. 18 n.c. 17 SHL 16 FSL 15 GHL
014aaa630
UBA2035TS
SU 10 DD 11 BD 12 RC 13 SGND 14
Fig 2.
Pinning diagram
6.2 Pin description
Table 2. Symbol VSS(CLK) CLK VDD(CLK) n.c. n.c. HV n.c. n.c. VDD SU DD BD RC SGND GHL FSL SHL n.c.
UBA2035_1
Pin description Pin UBA2035TS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 Description negative supply voltage for logic oscillator input oscillator input positive supply voltage for logic oscillator input not connected not connected high voltage supply input for internal series regulator not connected not connected internal low voltage supply input for start-up delay input for divider disable input for bridge disable RC input for internal oscillator signal ground gate driver output for upper left MOSFET floating supply left source upper left MOSFET not connected
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 31 October 2008
3 of 13
NXP Semiconductors
UBA2035
HF Full bridge control IC for HID lighting
Pin description ...continued Pin UBA2035TS 19 20 21 22 23 24 25 26 27 28 Description not connected gate driver output for lower left MOSFET power ground not connected gate driver output for lower right MOSFET not connected not connected source upper right MOSFET floating supply right gate driver upper right MOSFET
Table 2. Symbol n.c. GLL PGND n.c. GLR n.c. n.c. SHR FSR GHR
7. Functional description
7.1 Supply voltage
The UBA2035 is powered by a supply voltage applied to pin HV, e.g., the supply voltage of the full bridge. The IC generates its own low supply voltage for its internal circuitry. Therefore an additional low voltage supply is not required. A capacitor has to be connected to pin VDD to obtain a ripple-free internal supply voltage. The circuit can also be powered by a low voltage supply directly applied to pin VDD. In this case pin HV should be connected to pin VDD or pin SGND. The maximum current that the internal series regulator can deliver, is temperature dependent. See Figure 3.
7.2 Start-up
With an increasing supply voltage the IC enters the start-up state i.e. the upper power transistors are set in off-state and the lower power transistors are switched on. During the start-up state the bootstrap capacitors are charged. The start-up state is defined until VVDD = Vstartup(VDD) or VHV = Vstartup(HV). The state of the outputs during the start-up phase is overruled by the bridge disable function.
7.3 Oscillation state
As soon as the supply voltage on pin VDD exceeds Vstartup(VDD) or the supply voltage on pin HV exceeds Vstartup(HV), the output voltage of the full bridge depends on the control signals on pins CLK, SU, DD and BD. This is listed in Table 3. As soon as the supply voltage on pin VDD becomes lower than VUVLO(VDD) or the supply voltage on pin HV becomes lower than VUVLO(HV), the IC enters the start-up state again.
UBA2035_1
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Product data sheet
Rev. 01 -- 31 October 2008
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NXP Semiconductors
UBA2035
HF Full bridge control IC for HID lighting
Table 3. Driver Gate driver output voltages as function of the logical levels at the pins BD, SU, DD and CLK. Device state Start-up state Oscillation state BD 1 0 1 0 0 0 0
[1] [2]
SU 0 1 1 1
DD 1 1 0[1]
CLK 1 0 1 0[2]
GHL 0 (= VSHL) 0 (= VSHL) 0 (= VSHL) 0 (= VSHL) 0 (= VSHL) 1 (= VFSL) GHL
GHR 0 (= VSHR) 0 (= VSHR) 0 (= VSHR) 0 (= VSHR) 1 (= VFSR) 0 (= VSHR) GHR
GLL 0 (= VPGND) 1 (= VVDD) 1 (= VVDD) 1 (= VVDD) GLL
GLR 0 (= VPGND) 1 (= VVDD) 1 (= VVDD) 0 (= VPGND) GLR
0 (= VPGND) 0 (= VPGND)
0 (= VPGND) 1 (= VVDD)
If pin DD = 0 the bridge enters the state (oscillation state and pin BD = 0 and pin SU = 1) in the predefined position: VGHL = VFSL, VGLR = VVDD, VGLL = VPGND and VGHR = VSHR. Only if the level of pin CLK changes from logical 1 to 0, the level of outputs GHL, GHR, GLL and GLR changes.
If there is no external clock available, the internal oscillator can be used. The design equation for the bridge oscillator frequency is shown in Equation 1. 1 f bridge = -------------------------------------------K osc x R osc x C osc (1)
Rosc and Cosc are external components connected to the RC pin (Rosc connected to pin VDD and Cosc connected to pin SGND). In this situation the pins VDD(CLK), CLK, and VSS(CLK) can be connected to SGND. The clock signal, either coming from pin RC or pin CLK, can be divided by two in order to obtain a 50 % duty cycle gate drive signal. This can be achieved by applying a voltage to the DD input lower than VIL(DD) (e.g. connect pin DD to pin SGND).
7.4 Non-overlap time
In the full bridge configuration the non-overlap time is defined as the time between turning off the two conducting MOSFETs and turning on the two other MOSFETs. The (very small) non-overlap time is internally fixed to tno, which allows a HID system to operate with a very small phase angle between the load current and the full bridge voltage (pins SHL and SHR). This can be beneficial for HID systems in which the lamp is ignited via a resonance network.
7.5 Start-up delay
A simple resistor-capacitor (RC) filter (R between pin VDD and pin SU; C between pin SU and pin SGND) or a control signal from a processor can be used to create a start-up delay. This can be beneficial for those applications in which building up the high voltage takes more time. A start-up delay will ensure that the HID system will not start up before this high voltage has been reached.
UBA2035_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 31 October 2008
5 of 13
NXP Semiconductors
UBA2035
HF Full bridge control IC for HID lighting
7.6 Bridge disable
The bridge disable function can be used to switch off all MOSFETs as soon as the voltage on pin BD exceeds the bridge disable voltage VBD. The bridge disable function overrules all the other states.
8. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured with respect to signal ground (pin 14); positive currents flow into the chip. The voltage ratings are valid provided other ratings are not violated. Symbol General Tamb Tj Tstg Voltages VVDD VHV VSHL VSHR VFSL VFSR VGHL VGHR VGLL VGLR VPGND VSS(CLK) VDD(CLK) VI SR Currents Rosc ESD VESD electrostatic discharge voltage human body model: HV, VSS(CLK), VDD(CLK),CLK, FSL, FSR, GHL, GHR, SHL, SHR other pins machine model; all pins charged device model; all pins 900 2 200 500 V kV V V oscillator resistance connected between pins VDD and RC 100 k voltage on pin VDD voltage on pin HV voltage on pin SHL voltage on pin SHR voltage on pin FSL voltage on pin FSR voltage on pin GHL voltage on pin GHR voltage on pin GLL voltage on pin GLR voltage on pin PGND CLK ground supply voltage CLK supply voltage input voltage slew rate with respect to VSS(CLK) pin CLK; with respect to VSS(CLK) pins RC, SU, BD, and DD pins SHL and SHR with respect to PGND and SGND with respect to PGND and SGND with respect SHL with respect SHR 0 0 -3 -3 0 0 VSHL VSHR VPGND VPGND 0 -0.9 0 0 0 14 550 +550 +550 14 14 VFSL VFSR VVDD VVDD 5 14 14 14 VVDD 4 V V V V V V V V V V V V V V V V/ns ambient temperature junction temperature storage temperature -40 -40 -55 +125 +150 +150 C C C Parameter Conditions Min Max Unit
UBA2035_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 31 October 2008
6 of 13
NXP Semiconductors
UBA2035
HF Full bridge control IC for HID lighting
9. Thermal characteristics
Table 5. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air Typ 100 Unit K/W
10. Characteristics
Table 6. Characteristics Tj = 25 C; all voltages are measured with respect to signal ground (pin 14); currents are positive when flowing into the IC, unless otherwise specified. Symbol High voltage Ileak leakage current pin HV; IHV (VHV = 565 V) - IHV (VHV = 500 V) pin FSL; VFSL = VSHL = VGHL = 564 V pin FSR; VFSR = VSHR = VGHR = 564 V Start-up via HV pin II(HV) Vstartup(HV) VUVLO(HV) Vhys VVDD II(VDD) Vstartup(VDD) VUVLO(VDD) Vhys gate drivers Ron on-state resistance GHR and GHL drivers; VFSL = VFSR = 12 V; VSHL = VSHR = 0 V; IGHL = IGHR = -50 mA GLR and GLL drivers; VVDD = 12 V; VPGND = 0 V; IGLL = IGLR = -50 mA Roff off-state resistance GHR and GHL drivers; VFSL = VFSR = 12 V; VSHL = VSHR = 0 V; IGHL = IGHR = 50 mA GLR and GLL drivers; VVDD = 12 V; VPGND= 0 V; IGLL = IGLR = 50 mA 20 42 input current on pin HV start-up voltage on pin HV undervoltage lockout voltage on pin HV hysteresis voltage voltage on pin VDD input current on pin VDD start-up voltage on pin VDD undervoltage lockout voltage on pin VDD hysteresis voltage VHV = 20 V VVDD = 8.25 V VHV = 80 V 11.3 8.6 2 10.5 8.25 5.75 2 590 13.2 10.7 2.5 12 500 9.0 6.5 2.5 825 14.7 12.2 3 13.5 800 9.75 7.25 3 A V V V V A V V V 5 5 5 A A A Parameter Conditions Min Typ Max Unit
Start-up via VDD pin
-
20 12
42 26

-
12
26
UBA2035_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 31 October 2008
7 of 13
NXP Semiconductors
UBA2035
HF Full bridge control IC for HID lighting
Table 6. Characteristics ...continued Tj = 25 C; all voltages are measured with respect to signal ground (pin 14); currents are positive when flowing into the IC, unless otherwise specified. Symbol IO(source) Parameter output source current Conditions VFSL = VFSR = VVDD = 12 V; VSHL = VSHR = 0 V; VGHL = VGHR = VGLL = VGLR = 8 V VFSL = VFSR = VVDD = 12 V; VSHL = VSHR = 0 V; VGHL = VGHR = VGLL = VGLR = 8 V current on diode = 20 mA high side driver VFSL = VFSR = 12 V; VSHL = VSHR = 0 V VVDD = 12 V Min Typ 200 Max Unit mA
IO(sink)
output sink current
-
200
-
mA
Vd(bs) tno VUVLO IFS DD input VIH(DD) VIL(DD) II SU input Vstartup Vhys II CLK input VIH(CLK) Vhys II fbridge supply for CLK IDD(CLK) VDD(CLK) BD input VBD II Internal oscillator fosc(int) Kosc
bootstrap diode voltage non-overlap time undervoltage lockout voltage current on pin FS
2
2.3 80 4.0 4
250 5.5 6
V ns V A
HIGH-level input voltage on pin DD
6 1 0.9 5.75 1.23 -
4.5 0 1.3 100 0 1.6 100 0 420 1.29 0 0.97
3 1 1.5 1 2.7 1 250 625 14 1.35 1 100 1.05
V V A V mV A V mV A kHz A V V A kHz
LOW-level input voltage on VVDD = 12 V pin DD input current start-up voltage hysteresis voltage input current HIGH-level input voltage on pin CLK hysteresis voltage input current bridge frequency CLK supply current CLK supply voltage voltage on pin BD input current internal oscillator frequency oscillator constant VCLK = 0 V; VSS(CLK) = 0 V fbridge = 500 Hz VRC = 0 V VSS(CLK) = 0 V; VDD(CLK) = 14 V VSS(CLK) = 0 V VVDD = 12 V VVDD = 12 V VVDD = 12 V VVDD = 12 V VSS(CLK) = 0 V; VDD(CLK) = 12 V VSS(CLK) = 0 V; VDD(CLK) = 12 V
0.89
UBA2035_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 31 October 2008
8 of 13
NXP Semiconductors
UBA2035
HF Full bridge control IC for HID lighting
12 II(pin HV) (A) 8
014aaa631
(1)
(2)
4
(3)
0 0 200 400 VHV (V) 600
(1) Temperature = -25 C (2) Temperature = 25 C (3) Temperature = 125 C
Fig 3.
Typical II (pin HV) when VDD connected to SGND, as function of VHV and temperature
UBA2035_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 31 October 2008
9 of 13
NXP Semiconductors
UBA2035
HF Full bridge control IC for HID lighting
11. Package outline
SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1
D
E
A X
c y HE vMA
Z 28 15
Q A2 pin 1 index A1 (A 3) Lp L 1 e bp 14 wM detail X A
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 10.4 10.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 1.1 0.7 8 o 0
o
Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT341-1 REFERENCES IEC JEDEC MO-150 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 4.
UBA2035_1
Package outline SSOP28 (SOT341-1)
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 31 October 2008
10 of 13
NXP Semiconductors
UBA2035
HF Full bridge control IC for HID lighting
12. Revision history
Table 7. Revision history Release date 20081031 Data sheet status Product data sheet Change notice Supersedes Document ID UBA2035_1
UBA2035_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 31 October 2008
11 of 13
NXP Semiconductors
UBA2035
HF Full bridge control IC for HID lighting
13. Legal information
13.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
13.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
UBA2035_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 31 October 2008
12 of 13
NXP Semiconductors
UBA2035
HF Full bridge control IC for HID lighting
15. Contents
1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . 4 Start-up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Oscillation state . . . . . . . . . . . . . . . . . . . . . . . . 4 Non-overlap time . . . . . . . . . . . . . . . . . . . . . . . 5 Start-up delay . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Bridge disable . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 31 October 2008 Document identifier: UBA2035_1

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